SK hynix Orders Hybrid Bonding Gear from Applied Materials and Besi for Next-Gen HBM
SK hynix has placed its first order for mass-production hybrid bonding equipment jointly developed by Applied Materials and Besi. The equipment, valued at approximately 20 billion won, is intended for the development of next-generation High Bandwidth Memory (HBM). This technology enables direct copper-to-copper…
Read the full story