SK hynix Orders Hybrid Bonding Gear from Applied Materials and Besi for Next-Gen HBM

Key Facts

1SK hynix ordered a hybrid bonding inline system jointly developed by Applied Materials and Besi.

2The equipment is estimated at 20 billion won and is intended for the development of next-generation High Bandwidth Memory (HBM).

3The technology enables direct copper-to-copper bonding, improving integration density and performance in chips.

SK hynix has placed its first order for mass-production hybrid bonding equipment jointly developed by Applied Materials and Besi. The equipment, valued at approximately 20 billion won, is intended for the development of next-generation High Bandwidth Memory (HBM). This technology enables direct copper-to-copper bonding, significantly improving integration density and thermal performance compared to traditional microbump methods. The move signals a strategic shift toward advanced packaging for future HBM4 products and beyond, which are essential for demanding AI workloads. By adopting this technology early, SK hynix aims to maintain its dominant position in the highly competitive AI memory market. This milestone also underscores the growing industry transition to hybrid bonding as a new standard for high-end semiconductor manufacturing.