Applied Materials and Besi Expand Partnership for AI Chip Packaging

Key Facts

1Besi joined Applied Materials' EPIC Center as an Innovation Partner to advance hybrid bonding and thermo-compression bonding (TCB) technologies.

Applied Materials and BE Semiconductor Industries (Besi) announced an expansion of their strategic partnership to develop next-generation 3D IC scaling and hybrid bonding platforms. GlobeNewswire reported that Besi has joined Applied Materials' EPIC Center as an Innovation Partner to advance thermo-compression bonding (TCB) and interconnect technologies essential for AI infrastructure and photonics systems.

The collaboration aims to address increasing demand for advanced semiconductor packaging and the integration of logic and memory, building upon a joint center of excellence established by the two firms in Singapore in 2020. In equity markets, AMAT closed at $511.38 on September 30, 2026, having traded between a day high of $515.42 and a low of $506.78 during that session.