Samsung Forecasts HBM to Reach 30% of DRAM Capacity by 2027

Key Facts

1Samsung Electronics expects high-bandwidth memory (HBM) to account for nearly 30% of total DRAM wafer capacity next year.

2The current share of HBM in chipmakers' total wafer capacity stands at approximately 20%.

Samsung Electronics expects high-bandwidth memory (HBM) to account for nearly 30% of total DRAM wafer capacity next year. Reuters reported that this shift reflects a reallocation of production resources toward AI-optimized memory components, up from the current industry share of approximately 20%.

SMSN.L closed at $4824 on September 28, 2026, having traded between a day high of $4984 and a day low of $4798. The planned expansion in wafer capacity is a strategic response to the growing demand for high-margin memory units essential for artificial intelligence workloads.