StocksMedium•13 November 2026•
1 min read
TSMC Partners with Xintec to Expand AI Chip Packaging Capacity
Key Facts
1TSMC signed a seven-year agreement with Xintec to operate a CoWoS advanced packaging production line in Taichung.
2Xintec approved NT$15 billion in convertible bonds to fund the buildout, with volume production scheduled to begin in 2029.
TSMC signed a seven-year agreement with Xintec to operate a CoWoS advanced packaging production line in Taichung. Taiwan News reported that Xintec approved NT$15 billion in convertible bonds to fund the facility's construction, with volume production scheduled to begin in 2029.
The partnership aims to expand capacity for advanced packaging, which has become a critical bottleneck in the manufacturing of high-end AI processors. Regarding market performance, TSM closed at $405.49 on November 12, 2026, having traded between a day high of $411.77 and a low of $393.91 during that session.