StocksMedium•12 November 2026•
1 min read
Samsung Breaks Ground on $900M AI Chip Packaging Plant
Key Facts
1Samsung has broken ground on a $900 million plant to package high-bandwidth memory (HBM) chips at its Onyang campus.
Samsung has broken ground on a $900 million plant to package high-bandwidth memory (HBM) chips at its Onyang campus. Billionaires.Africa reported that the facility is designed to serve as a hub for advanced packaging of chips used in AI servers, with Chairman Jay Y. Lee attending the groundbreaking ceremony.
The project is part of a broader 144 trillion won strategic investment plan in the Chungcheong region to strengthen Samsung's position in the AI hardware supply chain. This expansion comes as the company moves to increase memory output for AI data centers, following the commencement of mass shipments of its sixth-generation HBM4 chips to NVIDIA earlier this year.