Samsung Plans 56 Trillion Won Investment in Memory Chip Packaging Facilities
Key Facts
Samsung Electronics announced a plan to invest 56 trillion won in facilities to package high-bandwidth memory chips in Onyang and Cheonan, according to a plan reported by Reuters on July 2, 2026. The announcement places the packaging facilities within the company’s expansion across the chip production chain, as demand growth in the industry is tied to the needs of artificial intelligence. The plan covers Samsung Electronics’ investment in packaging facilities and does not by itself represent the group’s total investment in the region. Reuters previously reported that Samsung Group aims to invest 140 trillion won in Chungcheong in display, battery, chip and chip materials production. This comes as part of a broader wave of South Korean investment in chip industry infrastructure, with other local companies also pursuing new manufacturing plans.
Reuters said Samsung’s investment in packaging facilities targets high-bandwidth memory chips, a category gaining importance as artificial intelligence applications expand. The plan identified two sites for the facilities, Onyang and Cheonan, in the central province of Chungcheong. Available information does not include a specific start date for operations at the packaging facilities, nor does it specify their expected impact on production capacity. In a separate plan announced in June, Samsung said it intended to invest 2,655 trillion won domestically, including 625 trillion won in the Honam, Chungcheong and Yeongnam regions. The broader plan covers AI chips, robotics, batteries and information technology components.
The South Korean government is organizing regions around specialized stages of the chip industry, assigning chip packaging to Chungcheong while expanding production of components and materials in southeastern centers. In June, Samsung Electronics and SK Hynix announced a joint investment of 800 trillion won in a new chip industry hub in the country’s southwest, in response to AI demand. The companies said each would build two chip manufacturing plants in the region. Together, the companies produce about two-thirds of the world’s memory chips, according to an Associated Press report on the plan. This regional distribution provides context for the packaging investment in Chungcheong, alongside the planned manufacturing plants in the southwest.
But implementing chip manufacturing projects requires suitable resources and sites. SK Hynix’s chairman said the project is large and complex and needs “large sites, along with adequate supplies of power and water and skilled labor.” This places infrastructure and workforce requirements among the factors involved in carrying out the announced industrial plans. The companies did not specify a completion date for the southwestern plants in their June announcement of the joint investment. Reuters’ details on Samsung’s 56 trillion won investment also did not include a completion date for the packaging facilities in Onyang and Cheonan. Samsung’s available ticker data on EL7 closed at 4016 on November 11, 2026.