IBM and Siemens Partner to Advance 3D Chip Technology for AI

Key Facts

1IBM and Siemens announced a collaboration to advance IBM’s nanostack semiconductor architecture toward commercial manufacturing.

IBM and Siemens announced a collaboration to advance IBM’s nanostack semiconductor architecture toward commercial manufacturing. Benzinga reported that the partnership focuses on integrating IBM's 3D chip packaging technology with Siemens' industrial software to support AI applications.

The partnership aims to scale IBM's nanostack technology for mass production to meet the growing hardware demands of AI workloads. Siemens (SIEGY) closed at $153.64 on October 13, 2026, having reached a day high of $154.43 and a low of $152.76 during that session.