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StocksMedium•8 September 2026•
1 min read

TSMC and Samsung Commit to ASML's High NA EUV Tools for AI Chip Production

Key Facts

1TSMC and Samsung have committed to using ASML's advanced High NA EUV lithography machines to meet growing demand for AI chips.
2Samsung plans to use the technology in 2028 for DRAM manufacturing, while TSMC expects adoption by 2030 for advanced chips.

Amid the accelerating global race for advanced computing power, TSMC and Samsung have officially committed to adopting ASML's High NA EUV lithography machines. This transition is essential for manufacturing the next generation of AI-capable chips that require unprecedented precision. According to reports, this commitment is driven by the escalating demand for semiconductors optimized for complex artificial intelligence applications.

The adoption timelines reveal strategic differences between the two giants, with Samsung planning to implement the technology by 2028 for DRAM manufacturing, while TSMC expects to integrate it by 2030 for advanced logic chips. Per market data, this long-term commitment provides significant revenue visibility for ASML and secures the technological roadmap for the semiconductor sector as manufacturing complexity increases.

Regarding market performance, TSM shares stood at $428.91 (at close September 4, 2026), having traded between a low of $419.42 and a high of $429.82 during that session. Investors are currently monitoring global macroeconomic stability, noting that Eurozone annual inflation reached 3.3% in early September, which may influence the financing landscape for large-scale technology capital expenditures.