Micron raises CapEx outlook, sees HBM market exceeding $100B by 2027

Key Facts

1Micron signals that the HBM total addressable market will cross $100B by 2027.

2Micron lifts its fiscal year 2026 CapEx guidance to around $27B.

Driven by surging AI demand, Micron signaled ambitious expectations for the high-bandwidth memory (HBM) market, indicating according to reports that the total addressable market could exceed $100 billion by 2027. The company also raised its fiscal year 2026 capital expenditure guidance to approximately $27 billion, reflecting confidence in continued demand growth for advanced memory solutions. These forward-looking statements reinforce a bullish outlook for Micron's AI-related semiconductor business.

The update comes amid strong demand for high-performance memory from data centers and AI applications. Per market data, MU shares closed at $1,048.51 on June 24, 2026, with an intraday range of $991.10 to $1,083.32. Micron competes with Samsung and SK Hynix in the HBM space, but its aggressive capacity investments could strengthen its competitive position.

On the trading front, MU shares showed a wide range in the last session, with potential support near $991 and resistance around $1,083. Investors are watching for further updates on the company's HBM production ramp, especially as global data center spending is expected to grow. Recent U.S. inflation data and upcoming interest rate decisions could influence the broader semiconductor sector.